2019 International Conference on Material Science and Semiconductor Devices  (MSSD2019)accepts original and unpublished papers. 

Please submit your papers as the following instructions:

Submission Methods

1.Full Paper (Presentation and Publication)

Accepted full papers will be invited to give the oral presentation at the conference and be publsihed in one of the Journals / conference proceeding. 

EI Paper Template (Template.rar)

*All submissions must not be less than 6 pages in length.

SCI Paper Template (English)  (Chinese)
*All submissions must not be less than 10 pages in length.

2.Abstract (Presentation only)

Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.

3.Submission Methods (Only select one way to submit/只选其中一种方式投稿)


Please send the full paper &  Paper Submission Form to AEIC SUBMISSION SYSTEM 

可选用系统投稿的方式,把论文初稿(word+pdf版)和 作者登记表发送到AEIC投稿系统

Or you can submit  your paper and Paper Submission Form to  ICMSSD@yeah.net

或采用邮件的方式,把论文初稿和作者登记表发送到  ICMSSD@yeah.net  (word and pdf)。



All SCI submission papers should only be submitted to service@keoaeic.org and noted  "SCI-ICMSSD".

SCI投稿只能通过邮箱 service@keoaeic.org投稿,并且投稿的时候务必备注“SCI稿件-ICMSSD”



  1) Papers submitted to the conference should be in English.

  2) Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is finished.
 3) All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally .

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